nichia sts-da1-2546 nichia corporation specifications for white led NSSW063At pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-2546 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 75 ma pulse forward current i fp 280 ma allowable reverse current i r 85 ma power dissipation p d 247 mw operating temperature t opr -40~110 c storage temperature t stg -40~110 c junction temperature t j 125 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =50ma 2.9 v luminous intensity i v i f =50ma 6.1 cd x - i f =50ma 0.31 - chromaticity coordinate y - i f =50ma 0.32 - * characteristics at t a =25c. * luminous intensity value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart.
nichia sts-da1-2546 2 ranks item rank min max unit forward voltage - 2.6 3.3 v z 5.76 8.00 y 4.00 5.76 luminous intensity x 2.88 4.00 cd color ranks rank a0 rank b1 x 0.280 0.264 0.283 0.296 x 0.287 0.283 0.330 0.330 y 0.248 0.267 0.305 0.276 y 0.295 0.305 0.360 0.339 rank b2 rank c0 x 0.296 0.287 0.330 0.330 x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318 y 0.318 0.360 0.385 0.351 * ranking at t a =25c. * tolerance of measurements of the forward voltage is 0.05v. * tolerance of measurements of the luminous intensity is 10%. * tolerance of measurements of the chromaticity coordinate is 0.01. * a shipment shall consist of leds in a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia.
nichia sts-da1-2546 3 chromaticity diagram a0 b1 b2 c0 0.20 0.25 0.30 0.35 0.40 0.45 0.20 0.25 0.30 0.35 0.40 0.45 x y
nichia sts-da1-2546 4 outline dimensions sts-da7-2994 NSSW063A ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.036g(typ) cathode mark (2.4) 2.8 (2.6) 3.2 anode cathode 2.2 (0.4) (1.1) (0.8) 2 0.3 (1.9) 0.8 0.3 3.5 0.3 0.8 0.3 (0.4)
nichia sts-da1-2546 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended hand soldering condition temperature 350c max soldering time 3sec max ? recommended soldering pad pattern ( g unit: mm) 4 4 9.5 2.6 1.5 4 1.5 blank boxes: solder resist opening , shaded areas: footprint * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be perform ed more than twice. hand soldering mu st not be performed more than once. * avoid rapid cooling. ramp down the temp erature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delaminati on and deformation, and wire br eaks, decreasing reliability. * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds wi ll or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. 120sec max pre-heat 180 to 200c 260c max 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-2546 6 tape and reel dimensions reel size: 2000pcs 2.85 0.1 sts-da7-2995 1 `?? 2000 ? * nxxx063x 0.25 0.05 2.15 0.1 3.65 0.1 ?` / ` trailer and leader top cover tape led ?? ` 400mm ?` 160mm ? trailer 160mm min(empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ? no. ( g unit: mm) cathode mark -0 1 +0.25 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1
nichia sts-da1-2546 7 packaging - tape & reel nichia led sts-da7-0006b nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ?? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-sealed moisture-proof bags. ????`??????`???? desiccants ? products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. ??\H?y?B???y? * ?`???????y?????? * ?QH??n?????u?p?????? * * u???`?????n?go??`y? using an original packaging material or equivalent in transit is recommended. do not expose to water, the box is not water-resistant. do not drop or shock the box. it may damage the products. moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K???`?
nichia sts-da1-2546 8 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous intensity
nichia sts-da1-2546 9 derating characteristics sts-da7-2996a ? no. NSSW063A derating1 0 20 40 60 80 100 0 20406080100120 (65, 75.0) (11 0, 18.8) dut y 10 100 1000 110100 280 75 S a ll owa bl e forwar d c urr ent ( ma ) ??-S ambient temperature vs allowable forward current S allowable forward current(ma) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a = 25c 250c/w
nichia sts-da1-2546 10 optical characteristics nssw063x ? no. sts-da7-2997 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 relative l umin osity( a.u .) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -30 -4 0 -50 -60 -70 -80 -9 0 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.51 50ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 50ma i fp = t a =25c
nichia sts-da1-2546 11 forward current characteristics / temperature characteristics NSSW063A sts-da7-2998a ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 100 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 vfif 10 100 1000 2.02.53.03.54.04.5 280 50 relative luminosity(a.u.) ??- ambient temperature vs relative luminosity for ward curren t( ma) ifiv 0 1 2 3 4 5 0 50 100 150 200 250 300 350 relative luminosity(a.u.) - forward current vs relative luminosity forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e ( v ) ?R forward voltage(v) ?? ambient temperature( c) ?? ambi ent t em p erature ( c ) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 50ma i fp = 50ma
nichia sts-da1-2546 12 forward current characteristics / temperature characteristics ? no. NSSW063A sts-da7-2999a taxy 0.26 0.28 0.30 0.32 0.34 0.26 0.28 0.30 0.32 0.34 -40 c 0c 2 5c 50c 110c x ifxy 0.26 0.28 0.30 0.32 0.34 0.26 0.28 0.30 0.32 0.34 50 ma 10ma 20ma 75ma 280ma x y y 50ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-2546 13 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #3 0/22 thermal shock jeita ed-4701 300 307 -40c to 110c, 1min dwell, 10sec transfer, precondition: 30c, 70%rh, 168hr 100cycles #1 0/100 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 110c(30min)~25c(5min) 100cycles #1 0/100 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/100 high temperature storage jeita ed-4701 200 201 t a =110c 1000hours #1 0/100 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/100 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/100 room temperature operating life t a =25c, i f =75ma test board: see notes below 1000hours #2 0/100 high temperature operating life t a =85c, i f =50ma test board: see notes below 1000hours #2 0/100 temperature humidity operating life 60c, rh=90%, i f =50ma test board: see notes below 1000hours #2 0/100 low temperature operating life t a =-40c, i f =50ma test board: see notes below 1000hours #2 0/100 permanence of marking jeita ed-4701 500 501 isopropyl alcohol, 235c, dipping time: 5min 1time #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 free fall 3drops from a height of 75cm #1 0/10 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positive or negative #1 0/22 notes: 1) test board: fr4 board thic kness=1.6mm, copper layer thickness=35m, r ja 250c/w 2) measurements are pe rformed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =50ma >u.s.l.1.1 #1 luminous intensity(i v ) i f =50ma u.s.l.1.1 #2 luminous intensity(i v ) i f =50ma nichia sts-da1-2546 14 cautions (1) storage conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performan ce degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferab ly the original moisture-proof bags for storage. after the ?period after opening? storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight cont ainer when not in use. exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristi cs. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substanc es which can affect silver plating, such as halogen. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds mi ght cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the use of silico nes may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. (2) directions for use when designing a circuit, the curre nt through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... leds should be operated in forward bias. driving circuits must not subject leds to either forward or reverse voltage while off . continuous reverse voltage can cause migration and led damage. for stabilizing the led characteristics, it is recomm ended to operate at greater than 10% nominal current. for outdoor use, necessary measures should be take n to prevent water, moisture and salt air damage. (3) handling precautions do not handle leds with bare hands, it may contamin ate the led surface and affect optical characteristics. in the worst case, catastrophic failure from excess pressu re through wire-bond breaks and package damage may result. when handling the product with tweezers, be ca reful not to apply excess ive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing wire-bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures.
nichia sts-da1-2546 15 (4) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerte d on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wriststrap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials proper grounding is required for all devices, equipment, and machinery used in product assembly. surge protection should be considered when designing of commercial products. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics insp ection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma (6) thermal management proper thermal management is an impo rtant when designing products with le ds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (7) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended sinc e it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advise d to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825- 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation.
nichia sts-da1-2546 16 (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor co ntrol system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer sh all inform nichia directly before disassembling or analysis. both the customers and nichia will agree on official specificatio ns of supplied produc ts before a customer 's volume production . specifications and appearance subject to change for improvement without notice.
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